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Bondexpo

AnnualTrade only
Mechanical ComponentsMachines-tools - ToolsAssembly and Handling TechnologyAdhesion, Paints & Coating Technologies
Adhesives and sealantsMetal surface finishing and platingRaw materials and componentsGerman-speaking markets
Bondexpo

Overview

Bondexpo is a German trade fair devoted to industrial bonding and joining technology. Held in Stuttgart, it looks at raw materials for adhesives and sealants plus the machinery of the adhesives industry, and runs annually for trade visitors.

Editions

  1. 2027approx.Oct 2027
  2. 2026Oct 6–8, 2026

Venue

Messepiazza 1

Organizer

Questions

When is Bondexpo held?

The next edition runs Oct 6–8, 2026.

Where is Bondexpo held?

It is held at ICS International Congresscenter Stuttgart | Messe Stuttgart in Stuttgart, Germany.

How often is Bondexpo held?

It is held Once a year.

Who can attend Bondexpo?

Admission: Trade only.

How do I contact the organizer of Bondexpo?

The organizer is P.E. Schall GmbH.

Oct 6–8, 2026Visit website