Adhesion & Bonding Expo - Osaka
AnnualTrade only
Overview
Adhesion and Bonding Expo Osaka is an industrial fair gathering joining equipment and bonding technology, from materials to welding, friction stirring and ultrasonics. It is held in Osaka Prefecture, Japan, once a year for trade visitors.
Editions
- 2027May 12–14, 2027
- 2026approx.Sep 30 – Oct 2, 2026
- 2026May 13–15, 2026
Venue
1-5-102 Nanko-Kita Suminoe-ku
Organizer
RX Global Events
United Kingdom501 trade shows
Related shows
Sep 30 – Oct 2, 2026
JapanChibaMakuhari Messe - Nippon Convention CenterOrganized by RX Global Events
Questions
When is Adhesion & Bonding Expo - Osaka held?
The next edition runs Sep 30 – Oct 2, 2026.
Where is Adhesion & Bonding Expo - Osaka held?
It is held at International Exhibition Center Osaka in Osaka Prefecture, Japan.
How often is Adhesion & Bonding Expo - Osaka held?
It is held Once a year.
Who can attend Adhesion & Bonding Expo - Osaka?
Admission: Trade only.
How do I contact the organizer of Adhesion & Bonding Expo - Osaka?
The organizer is RX Global Events.