IC Packaging Fair

AnnualTrade only
IC Packaging Fair

Overview

The IC Packaging Fair covers laminating technology, soldering gear and test and measurement systems for assembly work. It is held annually at the Shenzhen International Convention and Exhibition Center in Shenzhen, China, for trade visitors.

Editions

  1. 2027approx.Oct 2027
  2. 2026Oct 27–29, 2026

Venue

No. 1 Zhancheng Road, Fuhai Street - Bao'an District 518133 Shenzhen - China

Organizer

Questions

When is IC Packaging Fair held?

The next edition runs Oct 27–29, 2026.

Where is IC Packaging Fair held?

It is held at Shenzhen International Convention and Exhibition Center in Shenzhen, China.

How often is IC Packaging Fair held?

It is held Once a year.

Who can attend IC Packaging Fair?

Admission: Trade only.

How do I contact the organizer of IC Packaging Fair?

The organizer is RX China.

Oct 27–29, 2026Visit website