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IC & Sensor Packaging Expo Japan - Osaka

AnnualTrade only
Electronic Design & ComponentsMeasurement, Control & Testing
Raw materials and componentsSemiconductor equipment and materialsSemiconductors and chipsSensor technology
IC & Sensor Packaging Expo Japan - Osaka

Overview

IC & Sensor Packaging Expo Japan – Osaka is held at the International Exhibition Center Osaka. It covers electronic components and testing equipment for semiconductor packaging. Held annually for trade visitors.

Editions

  1. 2028approx.May 2028
  2. 2027May 12–14, 2027
  3. 2026May 13–15, 2026

Venue

1-5-102 Nanko-Kita Suminoe-ku

Organizer

Questions

When is IC & Sensor Packaging Expo Japan - Osaka held?

The next edition runs May 12–14, 2027.

Where is IC & Sensor Packaging Expo Japan - Osaka held?

It is held at International Exhibition Center Osaka in Osaka Prefecture, Japan.

How often is IC & Sensor Packaging Expo Japan - Osaka held?

It is held Once a year.

Who can attend IC & Sensor Packaging Expo Japan - Osaka?

Admission: Trade only.

How do I contact the organizer of IC & Sensor Packaging Expo Japan - Osaka?

The organizer is RX Global Events.

May 12–14, 2027Visit website